China Tech Digest: TSMC, Intel And Samsung Join Hands To Establish Chip Industry Standard; Inceptio Completes Road Test For L4 Unmanned Trucking

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TSMC, Intel and Samsung will join hands to establish chip industry standard

The world’s three largest chipmakers — TSMC, Intel and Samsung — will form a consortium with several other leading tech companies to collaborate on next-generation chip packaging and stacking. In addition to TSMC, Intel and Samsung, chip giants such as AMD, Qualcomm, Arm, Google Cloud, Meta and even Microsoft will join hands to establish the industry standard for advanced chips – packaging technology. The consortium said it was open to more companies joining.

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