China Tech Digest: Huawei Is Building The Largest Low-carbon Data Center In The Middle East And Africa; Canaan Joins Alibaba Cloud’s OpenAnolis Community


Huawei is building the largest low-carbon data center in the Middle East and Africa

The largest solar-powered data center in the Middle East and Africa contracted by Huawei Technologies and the Dubai Electricity & Water Authority has now formed a 2,000+ square meter computer room in the Middle East desert. The first phase of the data center is planned to be put into use in May this year, and will be put into trial operation in March. The overall planned area of the park exceeds 100,000 square meters and will be powered by 100% green electricity. It is the largest low-carbon data center in the Middle East and Africa.

Chinese power management ICs for LCD panels will value RMB6.5 billion in 2025

The market size of Chinese power management ICs for LCD panels was about RMB5.2 billion in 2021, and is expected to reach RMB6.5 billion in 2025, according to a CINNO Research report. In the first half of 2021, the top three suppliers of power management ICs for domestic display panel manufacturers are RICHTEK, GMT and NOVATEK, with a combined market share of about 74%. In the first half of 2021, the localization rate of power management ICs for domestic display panel factories has reached about 24%.

Canaan joins Alibaba Cloud’s OpenAnolis community

Alibaba Cloud’s open source community, OpenAnolis, announced a strategic cooperation with Canaan, a Chinese leading ASIC chip design company. The two parties will jointly explore the development and application of the OpenAnolis open source operating system and Kendryte AI chip platforms, and actively promote the practice of local open source projects in the field of end-to-end AI chips.

Established in September 2020, the OpenAnolis community is an open source operating system community and innovation platform jointly initiated by Chinese and foreign leading operating system, chip, and cloud computing companies.

Chip design firm Smart Logic completes US$100 million series C round

Chinese high-performance computing chip firm Smart Logic has completed a US$100 million series C round financing. Investors include TFTR Investment, CICC Capital and Chipone Technology. Existing investor Grand Flight Investment also participated. Smart Logic is a Chinese chip design firm, which primarily engages in the research and development of high performance processor (HPP), universal communication processor (UCP) and universal multimedia processor (UMP).

(China Money Network’s articles are curated and translated from credible Chinese media organizations with established brands, experienced editorial teams, and trustworthy journalism practices. However, we are not responsible for the accuracy of the information. For any questions, please reach out to our editorial department.)

 
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