Chinese semiconductor laser chip maker Everbright Photonics recently announced the completion of a RMB150 million (US$21.22 million) series C round financing led by Huatai Securities.
SDIC (Ningbo) Technology Achievement Transfer Venture Investment Fund, and Nanjing Daofeng Investment also participated in the round.
Founded in 2012, Everbright Photonics is committed to the R&D, production and sales of high-power semiconductor laser chips, high-efficiency VCSEL chips, high-speed optical communication chips, and related optoelectronic devices and application systems. It has built a complete process platform and mass production line from chip design, MOCVD (epitaxial), lithography, cleavage/coating to packaging and testing, fiber coupling, direct semiconductor laser, etc.
The company has repeatedly made breakthroughs in power, brightness, photoelectric conversion efficiency, and lifespan of high-brightness single chips, optical fiber coupled modules, high-power bar and stacked arrays.
Up to now, Everbright Photonics has completed four rounds of financing, raising over RMB300 million in total. In 2012, Everbright Photonics received an angel round from Changchun UP Optotech Co. Ltd, a China-based listing company; in 2016, it completed a series A round from East-lake Venture Capital; In 2018, SDIC Venture Capital joined the venture capital fund of Chinese Academy of Sciences, and Suzhou Chengxin Venture Capital to invest RMB150 million in Everbright Photonics.